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authFullName_s : Eric Bailly

Towards high temperature electronic modules in which all components would be attached using silver sintering

Thomas Geoffroy , Jean-Christophe Riou , Yves Bienvenu , Corinne Pons , Sylvain Meille , et al.
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), 2016, 2016 (HiTEC, mai), pp.000216--000225. ⟨10.4071/2016-HITEC-216⟩
Journal articles hal-01761574v1

Influence of thermo-mechanical stress on the microstructure of sintered silver joints for microelectronics

Thomas Geoffroy , Jean-Christophe Riou , Eric Bailly , Gilles Tarisse , Yves Bienvenu
2015 IEEE CPMT Symposium Japan (ICSJ), Nov 2015, Kyoto, Japan. pp.62-65, ⟨10.1109/ICSJ.2015.7357360⟩
Conference papers hal-01336867v1