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Towards high temperature electronic modules in which all components would be attached using silver sinteringAdditional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT), 2016, 2016 (HiTEC, mai), pp.000216--000225. ⟨10.4071/2016-HITEC-216⟩
Journal articles
hal-01761574v1
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Influence of thermo-mechanical stress on the microstructure of sintered silver joints for microelectronics2015 IEEE CPMT Symposium Japan (ICSJ), Nov 2015, Kyoto, Japan. pp.62-65, ⟨10.1109/ICSJ.2015.7357360⟩
Conference papers
hal-01336867v1
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